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  slls104i ? dec ember 1990 ? revised september 2004 1 post office box 655303 ? dallas, texas 75265  meets or exceeds the requirements of ansi tia/eia-422-b, tia/eia-423-b, and itu recommendation v.10 and v.11  low power, i cc = 10 ma typ  7-v common-mode range with 200-mv sensitivity  input hysteresis . . . 60 mv typ  t pd = 17 ns typ  operates from a single 5-v supply  3-state outputs  input fail-safe circuitry  improved replacements for am26ls32  available in q-temp automotive ? high reliability automotive applications ? configuration control/print support ? qualification to automotive standards description/ordering information the am26c32 is a quadruple differential line receiver for balanced or unbalanced digital data transmission. the enable function is common to all four receivers and of fers a choice of active-high or active-low input. the 3-state outputs permit connection directly to a bus-organized system. fail-safe design specifies that if the inputs are open, the outputs always are high. the am26c32 devices are manufactured using a bicmos process, which is a combination of bipolar and cmos transistors. this process provides the high voltage and current of bipolar with the low power of cmos to reduce the power consumption to about one-fifth that of the standard am26ls32, while maintaining ac and dc performance. the am26c32c is characterized for operation from 0 c to 70 c. the am26c32i is characterized for operation from ?40 c to 85 c. the am26c32q is characterized for operation from ?40 c to 125 c. the am26c32m is characterized for operation over the full military temperature range of ?55 c to 125 c. copyright ? 2004, texas instruments incorporated please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1b 1a 1y g 2y 2a 2b gnd v cc 4b 4a 4y g 3y 3a 3b am26c32c ... d, n, or ns p ackage am26c32i ... d, n, ns, or pw package am26c32q ...d p ackage am26c32m ...j or w p ackage (top view) 3212019 910111213 4 5 6 7 8 18 17 16 15 14 4a 4y nc g 3y 1y g nc 2y 2a am26c32m . . . fk package (top view) 1a 1b nc 3b 3a 4b 2b gnd nc cc v nc ? no internal connection
slls104i ? december 1990 ? revised september 2004 2 post office box 655303 ? dallas, texas 75265 description/ordering information (continued) ordering information t a package ? orderable part number top-side marking pdip (n) tube of 25 am26c32cn am26c32cn 0 c to 70 c soic (d) tube of 40 am26c32cd am26c32c 0 c to 70 c soic (d) reel of 2500 am26c32cdr am26c32c sop (ns) reel of 2000 am26c32cnsr 26c32 pdip (n) tube of 25 am26c32in am26c32in soic (d) tube of 40 am26c32id am26c32i ?40 c to 85 c soic (d) reel of 2500 am26c32idr am26c32i ?40 c to 85 c sop (ns) reel of 2000 am26c32insr 26c32i tssop (pw) tube of 90 am26c32ipw 26c32i ?40 c to 125 c soic (d) tube of 40 am26c32qd am26c32qd cdip (j) tube of 25 am26c32mj am26c32mj ?55 c to 125 c cfp (w) tube of 150 am26c32mw am26c32mw ?55 c to 125 c lccc (fk) tube of 55 am26c32mfk am26c32mfk ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. function table (each receiver) differential enables output differential input g g output y v id v it+ h x h v id v it+ x lh v it? < v id < v it+ h x ? v it? < v id < v it+ x l? v id v it? h x l v id v it? x ll x l h z h = high level, l = low level, x = irrelevant z = high impedance (off), ? = indeterminate
slls104i ? dec ember 1990 ? revised september 2004 3 post office box 655303 ? dallas, texas 75265 logic diagram (positive logic) 4y 3y 2y 1y 4b 4a 3b 3a 2b 2a 1b 1a g g pin numbers shown are for the d, j, n, ns, pw, and w packages. 4 12 2 1 6 7 10 9 14 15 3 5 11 13 schematics input v cc equivalent of a or b input typical of all outputs output v cc v cc 1.7 k ? nom gnd gnd 1.7 k ? nom 17 k ? nom 288 k ? nom v cc (a inputs) or gnd (b inputs) input gnd equivalent of g or g input
slls104i ? december 1990 ? revised september 2004 4 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage, v cc (see note 1) 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, v i : a or b inputs ?11 v to 14 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . g or g inputs ?0.5 v to v cc + 0.5 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . differential input voltage range, v id ?14 v to 14 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output voltage range, v o ?0.5 v to v cc + 0.5 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output current, i o 25 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see notes 2 and 3): d package 73 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . n package 67 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . ns package 64 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . pw package 108 c/w . . . . . . . . . . . . . . . . . . . . . . . . . operating virtual junction temperature, t j 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. all voltage values, except differential output voltage, v od , are with respect to network gnd. currents into the device are positive and currents out of the device are negative. 2. maximum power dissipation is a function of t j (max), ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ ja . operating at the absolute maximum t j of 150 c can affect reliability. 3. the package thermal impedance is calculated in accordance with jesd 51-7. recommended operating conditions min nom max unit v cc supply voltage 4.5 5 5.5 v v ih high-level input voltage 2 v v il low-level input voltage 0.8 v v ic common-mode input voltage 7 v i oh high-level output current ?6 ma i ol low-level output current 6 ma am26c32c 0 70 t a operating free-air temperature am26c32i ?40 85 c t a operating free-air temperature am26c32q ?40 125 c am26c32m ?55 125
slls104i ? dec ember 1990 ? revised september 2004 5 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended ranges of v cc , v ic , and operating free-air temperature (unless otherwise noted) parameter test conditions min typ ? max unit v it+ differential input high-threshold voltage v o = v oh (min), v ic = ?7 v to 7 v 0.2 v v it+ differential input high-threshold voltage v o = v oh (min), i oh = ?440 a v ic = 0 to 5.5 v 0.1 v v it? differential input low-threshold voltage v o = 0.45 v, v ic = ?7 v to 7 v ?0.2 ? v v it? differential input low-threshold voltage v o = 0.45 v, i ol = 8 ma v ic = 0 to 5.5 v ?0.1 ? v v hys hysteresis voltage (v it+ ? v it? ) 60 mv v ik enable input clamp voltage v cc = 4.5 v, i i = ?18 ma ?1.5 v v oh high-level output voltage v id = 200 mv, i oh = ?6 ma 3.8 v v ol low-level output voltage v id = ?200 mv, i ol = 6 ma 0.2 0.3 v i oz off-state (high-impedance state) output current v o = v cc or gnd 0.5 5 a i i line input current v i = 10 v, other input at 0 v 1.5 ma i i line input current v i = ?10 v, other input at 0 v ?2.5 ma i ih high-level enable current v i = 2.7 v 20 a i il low-level enable current v i = 0.4 v ?100 a r i input resistance one input to ground 12 17 k ? i cc supply current v cc = 5.5 v 10 15 ma ? all typical values are at v cc = 5 v, v ic = 0, and t a = 25 c. ? the algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet fo r common-mode input voltage. switching characteristics over recommended ranges of operation conditions, c l = 50 pf (unless otherwise noted) parameter test conditions am26c32c am26c32i am26c32q am26c32m unit parameter conditions min typ ? max min typ ? max unit t plh propagation delay time, low- to high-level output see figure 1 9 17 27 9 17 27 ns t phl propagation delay time, high- to low-level output see figure 1 9 17 27 9 17 27 ns t tlh output transition time, low- to high-level output see figure 1 4 9 4 10 ns t thl output transition time, high- to low-level output see figure 1 4 9 4 9 ns t pzh output enable time to high level see figure 2 13 22 13 22 ns t pzl output enable time to low level see figure 2 13 22 13 22 ns t phz output disable time from high level see figure 2 13 22 13 26 ns t plz output disable time from low level see figure 2 13 22 13 25 ns ? all typical values are at v cc = 5 v, t a = 25 c.
slls104i ? december 1990 ? revised september 2004 6 post office box 655303 ? dallas, texas 75265 parameter measurement information test circuit voltage waveforms 0 v output v oh v ol 10% 90% 90% 10% t tlh t thl t plh t phl 2.5 v ?2.5 v 50% input device under test a b v cc c l = 50 pf (see note a) input note a: c l includes probe and jig capacitance. figure 1. switching test circuit and voltage waveforms test circuit device under test g input g input v cc s1 r l = 1 k ? c l = 50 pf (see note a) v id = 2.5 v voltage waveforms t pzl , t plz measurement: s1 to v cc t pzh , t phz measurement: s1 to gnd 1.3 v g g (see note b) output (with v id = 2.5 v) output (with v id = ?2.5 v) t pzh t phz t pzh t phz t pzl t plz t pzl t plz v oh ?0.5 v v ol + 0.5 v v oh ?0.5 v v ol + 0.5 v 3 v 0 v 3 v 0 v v oh v ol v oh v ol 1.3 v 50% 50% a input b input notes: a. c l includes probe and jig capacitance. b. the input pulse is supplied by a generator having the following characteristics: prr = 1 mhz, duty cycle 50%, t r = t f = 6 ns. figure 2. enable/disable time test circuit and output voltage waveforms
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-9164001q2a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-9164001qea active cdip j 16 1 tbd a42 snpb n / a for pkg type 5962-9164001qfa active cfp w 16 1 tbd a42 snpb n / a for pkg type am26c32cd active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32cdble obsolete ssop db 16 tbd call ti call ti am26c32cde4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32cdr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32cdre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32cn active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type am26c32cne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type am26c32cnsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32cnsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32id active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32idble obsolete ssop db 16 tbd call ti call ti AM26C32IDE4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32idg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32idr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32idre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32idrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32in active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type am26c32ine4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type am26c32insr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32insre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32ipw active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32ipwe4 active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32ipwr active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim am26c32ipwrg4 active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 24-oct-2006 addendum-page 1
orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) am26c32mfkb active lccc fk 20 1 tbd post-plate n / a for pkg type am26c32mjb active cdip j 16 1 tbd a42 snpb n / a for pkg type am26c32mwb active cfp w 16 1 tbd a42 snpb n / a for pkg type am26c32qd active soic d 16 40 tbd cu nipdau level-1-220c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 24-oct-2006 addendum-page 2


mechanical data mlcc006b october 1996 post office box 655303 ? dallas, texas 75265 fk (s-cqcc-n**) leadless ceramic chip carrier 4040140 / d 10/96 28 terminal shown b 0.358 (9,09) max (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) a no. of min max 0.358 0.660 0.761 0.458 0.342 (8,69) min (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) ** 20 28 52 44 68 84 0.020 (0,51) terminals 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 12 13 14 15 16 18 17 11 10 8 9 7 5 4 3 2 0.020 (0,51) 0.010 (0,25) 6 1 28 26 27 19 21 b sq a sq 22 23 24 25 20 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a metal lid. d. the terminals are gold plated. e. falls within jedec ms-004



mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ?  8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
mechanical data mtss001c january 1995 revised february 1999 post office box 655303 ? dallas, texas 75265 pw (r-pdso-g**) plastic small-outline package 14 pins shown 0,65 m 0,10 0,10 0,25 0,50 0,75 0,15 nom gage plane 28 9,80 9,60 24 7,90 7,70 20 16 6,60 6,40 4040064/f 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 a 1 1,20 max 14 5,10 4,90 8 3,10 2,90 a max a min dim pins ** 0,05 4,90 5,10 seating plane 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-153
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated


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